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US 6,184,478 B2Granted
Printed wiring device with base layer having a grid pattern
AssigneeAdtec Incorporated
InventorsHajime Imano, Yoshikazu Kato
Life of this patent
Estimating the term…
Abstract
A printed wiring device includes an insulation layer, a base layer, i.e. grounding layer or power supply layer, disposed on the insulation layer, and a signal line disposed on the insulation layer at the opposite side of the base layer. A plurality of holes is formed in the base layer opposite to the signal line, so that an average capacitance value between the signal line and the base layer is decreased. Thus, even if the insulation layer is thinned without narrowing the width of the signal line, characteristic impedance of the signal line can be controlled at a desired value.
Claims6
A printed wiring device comprising:
- an insulation layer,
- at least one signal line layer having signal lines arranged parallel to each other at a predetermined interval and disposed on one side of the insulation layer, and
- a base layer used for one of a grounding layer and a power supply layer and disposed on the insulation layer at a side opposite to the at least one signal line layer, said base layer having a plurality of holes with a size so that characteristic impedance of the signal lines is set in a predetermined value, said holes being arranged regularly in a grid pattern having line portions and intersecting portions so that the signal lines incline at an acute angle to a line linking centers of adjacent holes in a row of the holes without overlapping the intersecting portions.
Dependencies are inferred from the claim text.