Semiconductor package
AssigneeMicron Technology, Inc.
InventorDavid J. Corisis
Life of this patent
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Abstract
A semiconductor package is provided which includes a substrate having a plurality of semiconductor dice mounted thereon. The substrate is divided into segments by grooves formed in the bottom surface of the substrate. Each semiconductor die is electrically connected to the substrate by electrical connections which extend from bond pads on the semiconductor die to corresponding bond pads on the substrate. An encapsulant is formed over each segment and contains grooves which correspond to the grooves of the substrate. Break points are thus formed at the grooves to permit the segments to be easily detached from the substrate to form individual integrated circuits.
Claims6
A semiconductor package, comprising:
- a substrate having a top surface and a bottom surface;
- a plurality of first grooves formed in at least a portion of the bottom surface, the plurality of first grooves dividing the substrate into a plurality of segments;
- a plurality of semiconductor dice bonded to the top surface, each of the plurality of semiconductor dice being positioned in one of the plurality of segments;
- an encapsulant formed onto each of the plurality of semiconductor dice;
- and
- a plurality of second grooves formed in the encapsulant to be substantially aligned with the plurality of first grooves.
Dependencies are inferred from the claim text.