Adhesive tape for electronic parts and liquid adhesive
AssigneeTomoegawa Paper Co., Ltd.
InventorsOsamu Oka, Takeshi Nishigaya, Fumiyoshi Yamanashi
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Abstract
The present invention provide a novel polyimide which is soluble in organic solvents and excels in heat resistance, and to a process for producing the polyimide. The polyimide of the present invention comprises a repeating unit represented by the formula (1) and having a number average molecular weight of from 4,000 to 200,000. wherein X is —SO2— or —C(═O)—OCH2CH2O—C(═O)—, and R1, R2, R3 and R4 are independently an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms.
Claims9
A liquid adhesive for electronic parts which comprises a polyimide resin comprising a repeating unit represented by the following formula (1) dissolved in an organic solvent:
- wherein X is —SO2— or —C(═O)—OCH2CH2O—C(═O)—, and R1, R2, R3 and R4 are independently an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms.
Dependencies are inferred from the claim text.