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US 6,184,140 B2Granted
Methods of making microelectronic packages utilizing coining
AssigneeTessera, Inc.
InventorMarcus J. Millet
Life of this patent
Estimating the term…
Abstract
A package for a microelectronic element is made by making a microelectronic component, including embossing a metal sheet to form thin and thick regions, then etching or otherwise removing metal from the sheet in a nonselective removal process and arresting the removal process when the thin regions are removed but before the thick regions are removed. A base material may be applied to the metal sheet to form a dielectric layer for the component. The component is assembled with a microelectronic element to form the package.
Claims42
A method of making a microelectronic package, comprising:
- (a) making at least one microelectronic component, comprising the steps of:
- (i) embossing a metal layer having a first face and a second face by engaging said metal layer between a pair of forming elements and deforming said metal layer by engagement with said forming elements so as to form thick and thin regions of metal in said metal layer;
- (ii) removing metal from said thick and thin regions of metal in said metal layer by a removal process which nonselectively removes metal from at least one face of said metal layer;
- and
- (iii) arresting said removal process after said thin regions of metal have been removed but prior to removal of said thick regions of said metal layer so that said thick regions of metal remain as first metallic elements;
- and
- (b) assembling each of said at least one microelectronic component with at least one microelectronic element.
4 more elements
A method of making a microelectronic package, comprising:
- (a) making at least one microelectronic component, comprising the steps of:
- (i) embossing a metal layer having a first face and a second face by engaging said metal layer between a pair of forming elements and deforming said metal layer by engagement with said forming elements so as to form thick and thin regions of metal in said metal layer;
- (ii) removing metal from said thick and thin regions of metal in said metal layer by a removal process which nonselectively removes metal from at least one face of said metal layer;
- (iii) arresting said removal process after said thin regions of metal have been removed but prior to removal of said thick regions of said metal layer so that said thick regions of metal remain as metallic elements;
- (iv) applying a base material to said first face of said metal layer after said embossing step so that a coherent layer of said base material intimately surrounds said protruding thick regions of metal and so that said thick regions of metal in said metal layer remain as conductive elements embedded in said base material after said removing and arresting steps;
- and
- (b) assembling each said at least one microelectronic component with at least one microelectronic element.
4 more elements
A method of making a microelectronic package, comprising:
- (a) making at least one microelectronic component, comprising the steps of:
- (i) embossing a metal layer having a first face and a second face by engaging said metal layer between a pair of forming elements and deforming said metal layer by engagement with said elements so as to form thick and thin regions of metal in said metal layer;
- (ii) removing metal from said thick and thin regions of metal in said metal layer by a removal process which nonselectively removes metal from at least one face of said metal layer;
- (iii) arresting said removal process after said thin regions of metal have been removed but prior to removal of said thick regions of metal in said metal layer so that said thick regions of metal in said metal layer remain as metallic elements;
- (iv) said step of embossing being performed so as to form thick regions of metal including thick regions of metal having different thicknesses, and wherein said removing step is arrested before the thinnest of said thick regions of metal have been removed so that said thick regions of metal remain as metallic elements, said metallic elements having different thicknesses;
- and
- (b) assembling each said at least one microelectronic component with at least one microelectronic element.
4 more elements
A method of making a microelectronic package, comprising:
- (a) making at least one microelectronic component, comprising the steps of:
- (i) embossing a metal layer having a first face and a second face by engaging said metal layer between a pair of forming elements and deforming said metal layer by engagement with said elements so as to form thick and thin regions of metal in said metal layer, at least some of the thick regions of metal having tapering sides;
- (ii) removing metal from said thick and thin regions of metal in said metal layer by a removal process which nonselectively removes metal from at least one face of said metal layer;
- (iii) arresting said removal process after said thin regions have been removed but prior to removal of said thick regions of metal so that said thick regions of metal remain as metallic elements,
- (iv) said steps of embossing, removing metal and arresting said removal process forming metallic elements including tapering sides;
- (v) applying a base material to said first face of said metal layer after said embossing step so that a coherent layer of said base material intimately surrounds said thick regions of metal and so that said thick regions of metal remain as conductive elements embedded in said base material after said arresting step, said tapering sides tapering outwardly toward a surface of said layer of base material;
- and
- (b) assembling each of said at least one microelectronic component with at least one microelectronic element.
5 more elements
A method of packaging a microelectronic element, comprising:
- (a) making at least one microelectronic component, comprising the steps of:
- (i) embossing a metal layer having a first face and a second face by engaging said metal layer between a pair of forming elements having recesses and projections in registrations and deforming said metal layer by engagement with said elements so as to form thick and thin regions of metal in said metal layer;
- (ii) removing metal from said thick and thin regions of metal in said metal layer by a removal process which nonselectively removes metal from at least one face of said metal layer;
- and
- (iii) arresting said removal process after said thin regions of metal have been removed but prior to removal of said thick regions of metal so that said thick regions of said metal layer remain as metallic elements;
- and
- (b) assembling each of said at least one microelectronic component with at least one microelectronic element.
4 more elements
Dependencies are inferred from the claim text.