Process of forming solid thin film from layer of liquid material without void and film forming apparatus used therein

A process of forming a solid thin film, comprising the steps of:

• a) preparing a substrate structure having at least one recess open to a surface of said substrate structure;
• b) changing the temperature of said substrate structure to lower than an ambient temperature;
• c) creating vacuum around said substrate structure;
• d) supplying liquid material onto said surface structure so as to form a layer of liquid material on said surface;
• e) pressing through exposure to high-pressure gas said layer of liquid material so as to perfectly fill said recess with said liquid material, wherein said high-pressure gas is selected from the group consisting of inert gas, hydrogen, nitrogen and a mixtures containing at least two gases selected from said group, and wherein and said high-pressure gas contains at least one element selected from Cu, Sc, Ti, Co, and W;
• and
• f) heating said liquid material so as to form a solid layer from said liquid layer.