Low resistivity poly-silicon gate produced by selective metal growth
AssigneeTexas Instruments Incorporated
InventorsMing Hwang, Jiong-Ping Lu, Duane E. Carter, Wei-Yung Hsu
Life of this patent
Estimating the term…
Loading patent…
AssigneeTexas Instruments Incorporated
InventorsMing Hwang, Jiong-Ping Lu, Duane E. Carter, Wei-Yung Hsu
Estimating the term…
A method for fabricating a low resistivity polymetal silicide conductor/gate comprising, the steps of forming a polysilicon (66) over a gate oxide (64) followed by protection of the polysilicon (66) with a sacrificial material (68), is disclosed. Gate sidewalls (70) are created to protect the sides of the polysilicon (66) and the sacrificial material (68), followed by stripped the sacrificial material (68) to expose the top surface of the polysilicon (66). Next, a diffusion barrier (76) is deposited over the exposed polysilicon (66) and a metal layer (78) is selectively grown on the diffusion barrier (76) to form a gate contact and conductor. Finally, a dielectric layer (80) is deposited over the selectively grown metal layer (78), the sidewalls (70) and the gate oxide (64).
A method of fabricating a polymetal silicide conductor/gate comprising:
A method of fabricating a polymetal silicide conductor/gate comprising:
A method of fabricating a polymetal silicide conductor/gate for embedded memory comprising:
Dependencies are inferred from the claim text.