US 6,184,076 B2 · DRAM contact process by localized etch-stop removal

Abstract

A method of removing an etch-stop layer such as Si3N4 from the vicinity of contact openings is described. A need for the removal of this material arises when the surface of the etch-stop layer is exposed during processing and the substrate is subjected to temperatures above 700° C. Because of the high intrinsic interfacial stress residing in the Si3N4, the thermal impact causes cracks in the layer which emanate from the corners of the contact openings and travel, with branching, over a considerable distance from the opening. These cracks are prone to moisture adsorption and contamination which can compromise the reliability and performance of contacts. In addition, where contact openings are formed through insulating layers having an intermediate etch-stop layer, protrusions of the etch-stop layer occur within the contact opening because of un-even etching. These protrusions shadow the flux of subsequently deposited barrier materials into the opening, thereby forming weak spots along the contact walls. Timely removal the etch-stop layer around the contact opening eliminates these protrusions.

A method for forming a DRAM integrated circuit having cylindrical capacitors in a cell array and having peripheral devices, comprising:

(a) providing a silicon wafer having a self-aligned-polysilicon gate MOSFETs formed on its surface, said MOSFETs being configured to form DRAM cell devices in an array and peripheral devices;
(b) forming a first insulative layer over said silicon wafer;
(c) patterning and etching bitline contact openings in said first insulative layer;
(d) depositing and patterning a first polysilicon layer over said silicon wafer and into said bitline contact openings to form bitlines;
(e) depositing a second insulative layer over said silicon wafer;
(f) depositing an etch-stop layer over said second insulative layer;
(g) patterning and etching openings for the lower sections of said cylindrical capacitors in said etch-stop layer, said second insulative layer and said first insulative layer;
(h) depositing a third insulative layer over said silicon wafer;
(i) depositing and patterning a first photoresist layer to define the upper sections of said cylindrical capacitors;
(j) etching said third insulative layer whereupon said etch-stop layer halts etching everywhere except in said openings which are etched to expose subjacent active areas of said cell devices;
(k) removing said first photoresist layer;
(l) depositing a first doped polysilicon layer over said silicon wafer;
(m) depositing a fourth insulative layer over said first doped polysilicon layer;
(n) planarizing said fourth insulative layer;
(o) etching said fourth insulative layer until the uppermost portions of said first doped polysilicon layer are exposed;
(p) etching said first doped polysilicon layer, removing only the exposed uppermost portions thereof, said uppermost portions being co-planar with said silicon wafer thereby forming a lower storage plates of said cylindrical capacitors;
(q) etching said fourth insulative layer with an isotropic wet etching technique;
(r) depositing a second photoresist layer over said silicon wafer;
(s) patterning a second photoresist layer to cover said cell devices thereby exposing said etch-stop layer over said peripheral devices;
(t) etching said etch-stop layer over said peripheral devices;
(u) Removing said second photoresist layer;
(v) depositing a capacitor dielectric layer over said silicon wafer;
(w) depositing a second doped polysilicon layer over said capacitor dielectric layer;
(x) patterning said second doped polysilicon layer thereby forming upper cell plates;
(y) depositing a fifth insulative layer over said silicon wafer;
(z) patterning and etching contact openings in said fifth insulative layer;
(aa) depositing a barrier layer over said silicon wafer;
(ab) forming contact metallization in said contact openings;
(ac) depositing and patterning a first layer of wiring metallization over said silicon wafer;
and
(ad) forming additional wiring layers separated by insulative layers and interconnected with vias to complete said DRAM integrated circuit.

28 more elements

Facts

Application

09/345,354Filed 1 Jul 1999 · division

Priority

2 Dec 1996

Granted

6 Feb 2001

Term ends

Not estimatedThe source records don’t support an estimate.

Classification10 codes

H10B 12/09
Manufacture or treatment: with simultaneous manufacture of the peripheral circuit region and memory cells
H10D 1/042
Of capacitors having no potential barriers: using deposition processes to form electrode extensions
H10D 1/716
Having non-planar surfaces, e.g. formed by texturisation: having vertical extensions
H10W 20/0698
Of conductive parts of the interconnections: local interconnections

DRAM contact process by localized etch-stop removal

Life of this patent

DRAM contact process by localized etch-stop removal

Life of this patent

Abstract

Claims12