Soft impact dispense method
AssigneeMicron Technology, Inc.
InventorBruce L. Hayes
Life of this patent
Estimating the term…
Abstract
A wafer treatment method semiconductor wafer is disclosed. The method may include supporting the wafer and flowing a continuous sheet of liquid in a predetermined non-perpendicular orientation relative to the wafer. The continuous sheet of liquid is applied to the wafer.
Claims25
A method of dispensing a process liquid from a liquid source onto a semiconductor wafer surface having a center comprising:
- rotating the wafer;
- dispensing the process liquid through a nozzle connected to the liquid source such that the process liquid exits the nozzle in a circumferentially continuous sheet onto the rotating wafer surface.
A wafer treatment method, comprising:
- supporting the wafer;
- flowing a circumferentially continuous sheet of liquid in a predetermined non-perpendicular orientation relative to the wafer;
- and
- applying the circumferentially continuous sheet of liquid on to the wafer.
A wafer treatment method comprising:
- rotating a wafer having a center about an axis;
- flowing a circumferentially continuous sheet of fluid in a circumferential flow path oriented in a predetermined non-perpendicular orientation relative to the wafer;
- and
- applying the circumferentially continuous sheet of liquid onto the wafer.
A wafer treatment method, comprising supporting a wafer;
- flowing a circumferentially continuous circular sheet of liquid in a predetermined orientation relative to the wafer;
- and
- forming a puddle of liquid on the wafer.
A method for treating a semiconductor wafer with a process liquid, comprising:
- rotating the semiconductor wafer;
- flowing a circumferentially continuous sheet of process liquid in a predetermined non-perpendicular orientation relative to the wafer;
- and
- applying the process liquid to the wafer at a predetermined rate.
A method of treating a semiconductor wafer with a process fluid, comprising:
- supporting the semiconductor wafer;
- dispensing process fluid in a direction perpendicular to a surface of the wafer;
- forming a circumferentially continuous sheet of process fluid;
- directing the circumferentially continuous sheet of process fluid in a predetermined non-perpendicular orientation relative to the surface of the semiconductor wafer;
- and
- applying the circumferentially continuous sheet of process fluid to the surface of the semiconductor wafer.
A method of treating a semiconductor wafer having a center, comprising:
- rotating the semiconductor wafer about an axis;
- dispensing a process liquid in an axial direction towards the semiconductor wafer;
- altering the direction of flow of the process liquid;
- forming the process liquid into a circumferentially continuous sheet of process liquid;
- and
- applying the circumferentially continuous sheet of process liquid to the semiconductor wafer.
A method for treating a semiconductor wafer, comprising:
- supporting the semiconductor wafer on a wafer support having an axis of rotation;
- flowing a process liquid through a portion of a nozzle coaxially oriented on the axis of rotation and adjacent to the semiconductor wafer such that the process liquid flows radially outward from the axis of rotation in a plurality of flow paths;
- providing resistance to the process liquid flowing in the plurality of flow paths such that the process liquid forms a circumferentially extending continuous sheet of process liquid as it exits the nozzle;
- and
- depositing the circumferentially extending continuous sheet of process liquid onto the semiconductor wafer.
Dependencies are inferred from the claim text.