Inorganic-containing photosensitive resin composition and method for forming inorganic pattern
AssigneeKansai Research Institute
InventorsMakoto Hanabata, Tokugen Yasuda
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AssigneeKansai Research Institute
InventorsMakoto Hanabata, Tokugen Yasuda
Estimating the term…
An inorganic pattern is formed by coating an inorganic substance-containing photosensitive composition comprising a photosensitive polymer (A), a condensable organic metal compound or a condensate thereof (B) and an inorganic filler having a functional group (C) on a base, exposing the coated layer, and developing the exposed layer to form a pattern, baking the pattern give an inorganic pattern. The photosensitive polymer (A) may be constituted of an oligomer or polymer, and a photosensitizer, and the condensable organic metal compound (B) may have a photosensitive group. The inorganic filler may be a monodispersed colloidal silica having a mean particle size of 2 to 100 nm. The proportions of the components (B) and (C) relative to 1 part by weight of the component (A) on a solid basis are about 1 to 25 parts by weight and about 1 to 20 parts by weight, respectively. Even when the content of an inorganic component is high, an inorganic pattern of high resolution can be formed with the use of the above resin composition.
An inorganic substance-containing photosensitive resin composition comprising, on a solid content basis, (A) 1 part by weight of a photosensitive organic oligomer or polymer, (B) 1 to 25 parts by weight of a condensable organic metal compound or a condensate thereof having a photosensitive group, and (C) 1 to 20 parts by weight of an inorganic filler having a photosensitive group wherein the amount of said inorganic filler having a photosensitive group (C) is larger than the total amount of said photosensitive organic oligomer or polymer (A) and said organic metal compound or a condensate thereof (B).
A process for production an inorganic substance-containing photosensitive resin composition, which comprises mixing, on a solid content basis, (A) 1 part by weight of a photosensitive organic oligomer or polymer, (B) 1 to 25 parts by weight of a condensable organic metal compound or a condensate thereof having a photosensitive group, and (C) 1 to 20 parts by weight of an inorganic filler having a photosensitive group wherein the amount of said inorganic filler having a photosensitive group (C) is larger than the total amount of said photosensitive organic oligomer or polymer (A) and said organic metal compound or a condensate thereof (B).
Dependencies are inferred from the claim text.