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AssigneeSeiko Epson Corporation
InventorsYoshiaki Mori, Katsuhiro Takahashi, Takuya Miyakawa, Yasushi Karasawa
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Brazing or soldering materials which effectively improve the wettability of the brazing alloy or solder without using flux and a method of manufacturing such materials are provided. A metallic base is placed on turntable inside a vacuum chamber. A copper target is affixed to a sputtering electrode above the metallic base. Air is removed from the vacuum chamber through a vacuum outlet to increase the vacuum therein to a specific pressure, and carbon tetrafluoride and argon are introduced from a gas inlet to control the sputter pressure. Thereafter, turntable is rotated while a high frequency voltage is applied between the target and the metallic base to form a halide layer, such as a layer of copper fluoride, on a surface of metallic base.
A soldering and brazing material, comprising:
A material used in one of soldering and brazing, comprising:
A method of manufacturing a soldering and brazing material, comprising a step of:
A method of manufacturing a material used in one of soldering and brazing, comprising the steps of:
A method of manufacturing a material used in one of soldering and brazing, comprising a step of:
A method of manufacturing a material used in one of soldering and brazing, comprising a step of:
A joined assembly, comprising:
A method of joining a first metal to a second metal to form a joined assembly, comprising the steps of:
Dependencies are inferred from the claim text.