Electronic circuit substrates fabricated from an aluminum ceramic composite material
AssigneeDowa Mining Co., Ltd.
InventorsXiao-Shan Ning, Choju Nagata, Masami Sakuraba, Toshikazu Tanaka, Katsuaki Suganuma, Masami Kimura
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Abstract
An electronic circuit substrate including an aluminum-ceramic composite material having an electronic circuit formed on aluminum or an aluminum alloy plate of the aluminum-ceramic composite material which is prepared directly solidifying molten aluminum or an aluminum alloy on at least a portion of a ceramic substrate.
Claims20
An electronic circuit substrate comprising an aluminum-ceramic composite material having an electronic circuit formed on aluminum or an aluminum alloy plate of said aluminum-ceramic composite material which is prepared by directly solidifying molten aluminum or an aluminum alloy on at least a portion of a ceramic substrate.
An electronic circuit substrate comprising an aluminum-ceramic composite material having a predetermined electronic circuit formed thereon by etching aluminum or an aluminum alloy plate of said composite material prepared by directly solidifying molten aluminum or an aluminum alloy on at least a portion of a ceramic substrate.
An electronic circuit substrate comprising an aluminum-ceramic composite material having an electronic circuit formed on an aluminum alloy plate of said aluminum-ceramic composite material which is prepared by directly solidifying molten aluminum on at least a portion of a ceramic substrate.
An electronic circuit substrate comprising an aluminum-ceramic composite material having a predetermined electronic circuit formed thereon by etching an aluminum alloy plate of said composite material prepared by directly solidifying molten aluminum on at least a portion of a ceramic substrate.
Dependencies are inferred from the claim text.