Method of staining a semiconductor wafer with a semiconductor treatment chemical
AssigneeMicron Technology, Inc.
InventorFrank E. Martini
Life of this patent
Estimating the term…
Abstract
A method for staining a portion of a semiconductor wafer sample with a semiconductor treatment chemical. On embodiment of the method includes gripping the semiconductor wafer sample in a first openly biasable slot in a flexible bar and suspending the semiconductor wafer into the chemical. Other embodiments of the method may further include gripping plural semiconductor wafer samples in openly biasable sots in flexible bars to enable a plurality of semiconductor wafer samples to be treated with a semiconductor treatment chemical.
Claims16
A method of treating at least a portion of a semiconductor wafer sample with a staining chemical, comprising:
- gripping a first portion of the semiconductor wafer sample in a first openly biasable slot in a first elongated flexible bar;
- and
- suspending at least a portion of the semiconductor wafer sample into the staining chemical.
A method for staining a semiconductor wafer sample with a semiconductor treatment chemical, said method comprising:
- gripping a first portion of the semiconductor wafer sample in a first openly biasable slot in a first flexible bar;
- gripping a second portion of the semiconductor wafer sample in a second openly biasable slot in a second flexible bar;
- gripping a third portion of the semiconductor wafer in a third openly biasable slot in a third flexible bar;
- and
- supporting the first, second and third flexible bars such that the semiconductor wafer sample contacts the semiconductor treatment chemical.
A method of preparing a semiconductor wafer sample for scanning electron microscopy analysis, comprising:
- removing a first sample from a semiconductor wafer;
- clamping a first portion of a first sample in a first slot in a first flexible bar;
- clamping a second portion of the first sample in a first slot in a second flexible bar;
- placing staining chemicals into an open topped container having an upper rim;
- and
- supporting the first and second flexible bars on the upper rim of the container such that the first sample contacts the staining chemicals within the container.
A method of preparing multiple semiconductor wafer samples for scanning electron microscopy analysis, comprising:
- sectioning a semiconductor wafer into a plurality of samples;
- clamping a first portion of a first sample in a first slot in a first flexible bar;
- clamping a second portion of the first sample in a first slot in a second flexible bar;
- clamping a first portion of a second sample in a second slot in the first flexible bar;
- clamping a second portion of the second sample in a second slot in the second flexible bar;
- placing staining chemicals into an open topped container having an upper rim;
- and
- supporting the first and second flexible bars on the upper rim of the container such that the first and second samples each contact the staining chemicals within the container.
A method of preparing multiple semiconductor wafer samples for scanning electron microscopy analysis, comprising:
- sectioning a semiconductor wafer into a plurality of samples;
- clamping a first portion of a first sample in a first slot in a first flexible bar;
- clamping a second portion of the first sample in a first slot in a second flexible bar;
- clamping a third portion of the first sample in a first slot in a third flexible bar;
- clamping a first portion of a second sample in a second slot in the first flexible bar;
- clamping a second portion of a second sample in a second slot in the second flexible bar;
- clamping a third portion of a second sample in a second slot in the third flexible bar;
- placing staining chemicals into an open topped container having an upper rim;
- and
- supporting the first, second and third flexible bars on the upper rim of the container such that the first and second samples each contact the staining chemicals within the container.
A method of preparing multiple semiconductor wafer samples for scanning electron microscopy analysis, comprising:
- sectioning a semiconductor wafer into a plurality of samples;
- clamping a first portion of a first sample in a first slot in a first flexible bar;
- clamping a second portion of the first sample in a first slot in a second flexible bar;
- clamping a third portion of the first sample in a first slot in a third flexible bar;
- clamping a first portion of a second sample in a second slot in the first flexible bar;
- clamping a second portion of a second sample in a second slot in the second flexible bar;
- clamping a third portion of a second sample in a second slot in the third flexible bar;
- clamping a first portion of a third sample in a third slot in the first flexible bar;
- clamping a second portion of the third sample in a third slot in the second flexible bar;
- clamping a third portion of the third sample in a third slot in the third flexible bar;
- placing staining chemicals into an open topped container having an upper rim;
- and
- supporting the first, second and third flexible bars on the upper rim of the container such that the first, second and third samples each contact the staining chemicals within the container.
Dependencies are inferred from the claim text.