Sputter target assembly having a metal-matrix-composite backing plate and methods of making same

Abstract

A method of producing a sputter target assembly including a metal target attached to a metal-matrix-composite backing plate and sputter target assemblies made thereby. The method includes hot isostatically pressing a silicon carbide-aluminum powder composition to form a backing plate while simultaneously bonding the powder composition to a metal target to form a diffusion-type bond between the target and the backing plate such that the target assembly possesses extremely high resistance to warpage at high operating temperatures. A second embodiment of the sputter target assembly includes an annular sealing member of machined aluminum disposed in the backing plate around the target.

Dependencies are inferred from the claim text.