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US 6,183,669 B2Granted
Paste composition, circuit board using the same, ceramic green sheet, ceramic substrate, and method for manufacturing ceramic multilayer substrate
AssigneeMurata Manufacturing Co., Ltd.
InventorsMasahiro Kubota, Michiaki Iha, Shizuharu Watanabe
Life of this patent
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Abstract
There is disclosed a paste composition including (A) an organic binder comprising acidic functional groups; (B) an inorganic powder containing multivalent metal compounds; and (C) a mono-ol compound having a boiling point of about 178° C. or more. The paste composition enables various fine patterns such as via-holes with high precision, by suppressing gelation caused by mixing an organic binder having acidic functional groups and a compound containing multivalent metals.
Claims18
A paste composition comprising:
- (A) an organic binder comprising acidic functional groups;
- (B) an inorganic powder comprising a multivalent metal compound;
- and
- (C) a mono-ol compound having a boiling point of about 178° C. or more.
1 more element
Dependencies are inferred from the claim text.