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US 6,183,622 B2Granted
Ductility additives for electrorefining and electrowinning
AssigneeEnthone-OMI, Inc.
InventorRobert Janik
Life of this patent
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Abstract
A method of electrowinning, electrorefining or electroforming of ductile copper deposits. The method uses an adduct of a tertiary alkyl amine with polyepichlorohydrin in amounts effective for ductilizing a copper deposit form a copper electrolyte.
Claims6
A method for improving the ductility of copper produced by the electrowinning or electrorefining of copper from a copper electrolyte bath comprising:
- providing a copper electrolysis bath including ionic copper and adding an addition agent consisting essentially of a bath soluble adduct of a tertiary alkyl amine having the formula
- wherein:
- R is methyl, ethyl or mixtures of a methyl and ethyl;
- A is an integer greater than 0;
- B is either 0 or an integer greater than 0;
- the sum of A+B is from about 4 to about 500;
- and
- in an amount sufficient to increase the ductility of the produced copper, and
- electroplating a copper deposit from said bath onto a cathode.
6 more elements
Dependencies are inferred from the claim text.