Rotating sputter magnetron assembly

A magnetron assembly positionable at a backside of a sputtering target and rotatable about a center position of said target, comprising a single magnetron asymmetrically disposed about said center position and including:

• a first pole of a first magnetic polarity comprising a closed band having a central aperture and extending from said center position of said target across a first distance toward a circumferential periphery of said target;
• and
• a second pole of a second magnetic polarity disposed in said aperture and separated from said first pole by a gap extending along a surface of said target;
• wherein said outer pole encloses first area divided into an inner area closer to said center position than half of said first distance and an outer area further from said center position than half of said first distance, wherein said outer area is greater than said inner area and wherein said first pole creates a total magnetic flux at least 50% greater than that created by said second pole.

A magnetron assembly positionable at a backside of a sputtering target and rotatable about a center position of said target, comprising a single magnetron asymmetrically disposed about said center position and including:

• a first pole of a first magnetic polarity comprising a closed band extending a first distance from said center position of said target toward a circumferential periphery of said target and having two opposed straight portions extending substantially parallel to said radius of said target and disposed asymmetrically with respect to said center position;
• a second pole of a second magnetic polarity opposite said first magnetic polarity disposed in said aperture and separated from said first pole by a gap extending along a surface of said target;
• and
• a first plurality of magnets of a first magnetic strength disposed as part of said first pole;
• and
• a second plurality of magnets of a second magnetic strength greater than said first magnetic strength disposed as part of said second pole.

A magnetron assembly positionable at a backside of a sputtering target and rotatable about a center position of said target, comprising:

• a first pole of a first magnetic polarity, producing a first value of a total magnetic flux, and comprising a closed band having a central aperture extending a first distance from said center position of said target toward a circumferential periphery of said target;
• and
• a second pole of a second magnetic polarity opposite said first magnetic polarity, producing a second value of a total magnetic flux, disposed in said aperture, and separated from said first pole by a gap extending along a surface of said target;
• wherein a ratio of said first value to said second value is at least 1.5.

A triangularly shaped magnetron, comprising:

• a triangularly shaped inner pole face;
• a plurality of first magnets of a first magnetic polarity disposed in an hexagonal close-packed arrangement adjacent to a planar side of said inner pole face;
• a generally triangularly shaped outer pole face surrounding said inner pole face and having two substantially straight sides meeting at an apex and a third side joined to ends of said straight sides opposite said apex;
• and
• a plurality of second magnets of a second magnetic polarity disposed in a closed path along and adjacent to a planar side of said outer pole face.

A plasma sputtering reactor, comprising:

• a vacuum chamber;
• a pedestal for supporting a substrate within said chamber;
• a sputtering target in opposition to said pedestal and adapted to be electrically coupled for plasma sputtering;
• and
• a magnetron disposed on a side of said target opposite said pedestal and including an outer pole face of a first magnetic polarity and surrounding an inner pole face of a second magnetic polarity opposite said first magnetic polarity and a rotation shaft for rotating said magnetron about a center position of said target;
• wherein said outer pole face encloses a first area divided into an inner area closer to said center position than half of a first distance extending from said center position of said target to an outer periphery of said target and an outer area further from said center position of said target than half of said first distance;
• and
• wherein said outer pole face has an egg shape with a minor axis located closer to said periphery of said target than said center position thereof.

A plasma sputtering reactor comprising:

• a vacuum chamber;
• a pedestal for supporting a substrate within said chamber;
• a sputtering target in opposition to said pedestal and adapted to be electrically coupled for plasma sputtering;
• and
• a magnetron disposed on a side of said target opposite said pedestal and including an outer pole face of a first magnetic polarity and surrounding an inner pole face of a second magnetic polarity opposite said first magnetic polarity and a rotation shaft for rotating said magnetron about a center position of said target;
• wherein said outer pole face encloses a first area divided into an inner area closer to said center position than half of a first distance extending from said center position of said target to an outer periphery of said target and an outer area further from said center position of said target than half of said first distance, wherein said outer pole face creates a total magnetic flux at least 50% larger than that created by said inner pole face.

A plasma sputtering reactor, comprising:

• a vacuum chamber;
• a pedestal for supporting a substrate within said chamber;
• a sputtering target in opposition to said pedestal and adapted to be electrically coupled for plasma sputtering;
• and
• a magnetron disposed on a side of said target opposite said pedestal and including an outer pole face of one magnetic polarity producing a total magnetic flux of a first value, surrounding an inner pole face of another magnetic polarity producing a total magnetic flux of a second value, and a rotation shaft for rotating said magnetron about a center of said target;
• wherein a ratio of said first value to said second value is at least 1.5.

A magnetron assembly positionable at a backside of a sputtering target and rotatable about a center position of said target, comprising a single magnetron asymmetrically disposed about said center position aid including:

• an outer pole of a first magnetic polarity arranged along a closed band having a central aperture and extending from an inner point of said target across a first distance toward a circumferential periphery of said target;
• and
• an inner pole of a second magnetic polarity disposed in said aperture and separated from said outer pole by a gap extending along a surface of said target;
• wherein said outer pole creates a total magnetic flux at least 50% greater than that created by said inner pole.