AC powered system for continuous deposition of a cathode material

A system for sputter deposition of a cathode material to form a material upon a substrate in a continuous operating mode, said system comprising:

• (a) a coating chamber in which a plasma is created comprising ions and electrons;
• (b) at least one anode disposed in said chamber;
• (c) a cathode disposed in said chamber adjacent to said plasma, said cathode containing atoms that can be sputtered therefrom in response to bombardment by said ions from said plasma to deposit a film on a surface of said substrate;
• and
• (d) an ac supply of power at a frequency such that said cathode assumes a self bias potential which is negative relative to the plasma wherein said ac supply of power is connected to said anode and said cathode so as to cause said anode to be driven alternately to an ion-collecting state wherein said anode attracts said ions when said anode is maintained at a negative potential relative to said plasma, and an electron-collecting state wherein said anode attracts said electrons when said anode is maintained at a positive potential relative to said plasma, said ion-collecting state and said electron-collecting state occurring while said cathode is maintained at a negative potential relative to said plasma by said supply of power.

A method for sputter deposition of an insulating material on a substrate in a continuous operating mode, said method comprising:

• (a) providing a coating chamber in which a plasma is created of ions and electrons;
• (b) providing at least two anodes in said chamber;
• (c) providing a cathode in said chamber adjacent to said plasma, said cathode containing atoms that may be sputtered therefrom in response to bombardment by ions from said plasma to form and deposit a material on said substrate;
• (d) maintaining said cathode at a negative potential relative to said plasma by an ac supply of power;
• and
• (e) alternating said anodes between an ion-collecting state wherein said anodes attract said ions when maintained at a negative potential relative to said plasma, and an electron-collecting state wherein said anodes attract said electrons when maintained at a positive potential relative to said plasma by said ac supply of power, said ion-collecting state and said electron-collecting state occurring while said cathode is maintained at a negative potential relative to said plasma, and wherein said step of alternating said anodes occurs at a frequency such that said cathode assumes a self bias potential which is negative relative to the plasma.

A method for sputter deposition of a material on a substrate in a continuous operating mode, said method comprising:

• (a) providing a coating chamber;
• (b) generating a plasma of ions and electrons therein;
• (c) providing at least one anode in said chamber;
• (d) providing a cathode in said chamber adjacent to said plasma, said cathode containing atoms that are sputtered therefrom in response to bombardment by ions from said plasma to form and deposit a material on said substrate;
• (e) maintaining said cathode at a negative potential relative to said plasma by an ac supply of power, and;
• (f) alternating said anode so as to cause said anode to be driven alternately to an ion-collecting state wherein said anode attracts said ions when said anode is maintained at a negative potential relative to said plasma, and an electron-collecting state wherein said anode attracts said electrons when said anode is maintained at a positive potential relative to said plasma by said ac supply of power, said ion-collecting state and said electron-collecting state occurring while said cathode is maintained at a negative potential relative to said plasma, and wherein said step of alternating said anodes occurs at a frequency such that said cathode assumes a self bias potential which is negative relative to the plasma.