Method for manufacturing lead-on-chip (LOC) semiconductor packages using liquid adhesive applied under the leads

A method for manufacturing lead-on-chip semiconductor packages, comprising steps of:

• loading a semiconductor chip to a bonding stage and loading a lead frame to transfer rails, the semiconductor chip having an active surface on which a plurality of electrode pads are formed, and the lead frame having a plurality of inner leads and a plurality of outer leads;
• dispensing a liquid adhesive having a certain viscosity directly onto bottom surfaces of the plurality of inner leads using an adhesive applying tool disposed at least partly below the transfer rails, to thereby apply the liquid adhesive to the plurality of inner leads;
• moving the bonding stage to position the semiconductor chip below the lead frame after the adhesive is dispensed onto the bottom surfaces of the plurality of inner leads, wherein the plurality of electrode pads of the semiconductor chip are exposed through a space defined between opposing rows of the plurality of inner leads;
• and
• pressing the active surface and the liquid adhesive directly against one another, whereby a single layer of adhesive attaches the plurality of leads to the semiconductor chip.