Apparatus for depositing thin films on semiconductor wafers

An apparatus for depositing thin films on a semiconductor wafer, comprising:

• a reactor block receiving a semiconductor wafer, said reactor block having an inner wall;
• a shower head plate covering the reactor block to maintain internal pressure in the reactor block at a predetermined level;
• a reaction gas supply for supplying reaction gases, the reaction gas supply connected to the shower head plate;
• an inert gas supply for supplying an inert gas, the inert gas supply connected to the shower head plate;
• an exhaust portion for exhausting the reaction and inert gases out of the reactor block, the exhaust portion connected to the reactor block;
• and
• a diffusion plate having a plurality of passages connected to the inert gas supply, a plurality of nozzles connected to the passages, the inert gas sprayed through the nozzles creating a wall of inert gas along the inner wall of the reactor block, and a plurality of spray holes, the reaction gases spread over the wafer through the spray holes, the diffusion plate installed in the shower head plate and having an outer circumference;
• the nozzles being formed along the outer circumference of the diffusion plate and being slanted toward the inner wall of the reactor block to prevent the deposition of reaction gases thereon.