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AssigneeTexas Instruments Incorporated
InventorRobert M. Adair, Jr.
Estimating the term…
An ultra-clean environment for fabrication of semiconductor devices which includes an air transmissive conveyor for conveying semiconductor wafers thereon and a plurality of robotic elements. A clean channel encloses the conveyor. The clean channel includes a filtered air intake extending from one surface of the conveyor and an air exhaust region extending in a direction opposite the air intake. The robotic elements is disposed external to and communicating with the clean channel. Laminar flow of filtered air is provided from the air intake to the air exhaust. The conveyor preferably traverses a serpentine path. The path of the conveyor is substantially bi-directional in that it travels in a first direction in then in the opposite direction immediately adjacent the portion traveling in the first direction. Robotic elements are disposed external to the clean channel, communicate with the clean channel and are at a reduced pressure relative to the clean channel. A plurality of said conveyors can be disposed within the clean channel, preferably stacked one floor atop the other. Each tool has its support skid immediately adjacent to the tool it serves.
An ultra-clean environment for fabrication of semiconductor devices which comprises:
An ultra-clean environment for fabrication of semiconductor devices which comprises:
An ultra-clean environment for fabrication of semiconductor devices which comprises:
Dependencies are inferred from the claim text.