Polishing apparatus
AssigneeEbara Corporation
InventorsKatsuhide Watanabe, Noburu Shimizu, Ichiju Satoh
Life of this patent
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AssigneeEbara Corporation
InventorsKatsuhide Watanabe, Noburu Shimizu, Ichiju Satoh
Estimating the term…
The polishing apparatus can control the attitude of the top ring with respect to a surface of a turntable of a polishing apparatus is controlled so as to provide a uniform polish surface pressure across the entire polish surface. The polishing apparatus includes the turntable having an abrading surface, a top ring for holding an object to be polished to keep the object surface in moving contact with the abrading surface while rotating the turntable and the top ring, a magnetic bearing assembly for supporting a rotation shaft of the top ring by means of a thrust bearing device and at least one radial bearing device, and an attitude controller for controlling an orientation of the top ring with respect to the turntable through the magnetic bearing assembly.
A polishing apparatus for polishing a surface of an object to a high degree of flatness, said apparatus comprising:
Dependencies are inferred from the claim text.