Inkjet printhead and fabrication method for integrating an actuator and firing chamber

An inkjet printhead comprising:

• a semiconductor substrate having a first surface and a second surface, said first and second surfaces being oppositely directed major surfaces of said semiconductor substrate;
• a plurality of heating elements photolithographically formed on said first surface of said semiconductor substrate to define an array of heating elements in parallel with said first surface;
• electronic circuitry formed within said semiconductor substrate and connected to said heating elements such that activation of said electronic circuitry triggers current flow through said heating elements said electronic circuitry including a separate switching device for each of said heating elements, said switching devices being individually addressable;
• said semiconductor substrate having a plurality of ink firing chambers extending in general alignment with said heating elements and extending through said semiconductor substrate from said first surface to said second surface, each ink firing chamber having a configuration compatible with anisotropic etching to define an area to receive a volume of fluid ink for projection from said ink firing chamber in response to activation of one of said heating elements, each of said ink firing chambers having a truncated pyramidal configuration having a generally rectangular opening at said second surface of said semiconductor substrate, said ink firing chambers being in one-to-one correspondence with said heating elements such that each heating element extends across a corresponding ink firing chamber at said first surface;
• a flow control mechanism for each of said ink firing chambers, each said flow control mechanism being positioned over a heating element such that said heating element is situated between said flow control mechanism and an ink firing chamber that corresponds to said heating element;
• and
• a supply manifold in fluid communication with each of said ink firing chambers to replenish said ink firing chambers with said fluid ink, said supply manifold including a manifold substrate attached to said first surface of said semiconductor substrate.