System and method for processing ingots
AssigneeNippei Toyama Corporation
InventorsYoshiaki Banzawa, Nobuaki Hayashi, Kiyoakira Shimizu
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AssigneeNippei Toyama Corporation
InventorsYoshiaki Banzawa, Nobuaki Hayashi, Kiyoakira Shimizu
Estimating the term…
An apparatus for manufacturing a plurality of wafers by slicing a cylindrical ingot with a wire saw. The apparatus includes a measuring device for measuring the crystal orientation of the ingot; an adhering device for adhering a support to the surface of the ingot based on the orientation where the support includes an intermediate plate and a support plate, where the support plate is adapted to fit the wire saw, and where the adhering device includes an auxiliary adhering element for adhering the intermediate plate to the surface of the ingot and an adhering element for adhering the support plate to the intermediate plate; a dryer for drying and solidifying an adhesive applied between the ingot and the intermediate plate and an adhesive applied between the intermediate plate and the support plate; and the wire saw for slicing the ingot into the plurality of wafers while the ingot is supported on the support. The apparatus may include stockers for storing the ingot and transferring devices for transferring the ingot within the apparatus.
An apparatus for simultaneously manufacturing a plurality of wafers by slicing a cylindrical ingot with a wire saw, the ingot having a crystal orientation, said apparatus comprising:
An apparatus for simultaneously manufacturing a plurality of wafers by slicing a cylindrical ingot with a wire saw, the ingot having a crystal orientation, the apparatus;
An apparatus for simultaneously manufacturing a plurality of wafers by slicing a cylindrical ingot with a wire saw, the ingot having a crystal orientation, the apparatus comprising:
An apparatus for simultaneously manufacturing a plurality of wafers by slicing a cylindrical ingot with a wire saw, the ingot having a crystal orientation, the apparatus comprising:
Dependencies are inferred from the claim text.