Apparatus and methods for separating microelectronic packages from a common substrate
AssigneeTessera, Inc.
InventorWalter G. Hecker
Life of this patent
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Abstract
An apparatus for excising microelectronic packages assembled to a common substrate includes a mechanical element which travels over a path defined on the common substrate, a castor element pivotally mounted to the mechanical element for movement about a pivot axis, and a cutting wheel rotatably mounted to the castor element so as to provide a castoring action for the cutting wheel. The cutting wheel has an asymmetrical cutling edge which selectively engages the common substrate so that when the mechanical element guides the cutting wheel over the path, the cutting edge severs the common substrate to provide one or more of the microelectronic packages separate from one another.
Claims26
An apparatus for separating microelectronic packages assembled to a common substrate comprising:
- a mechanical element which is capable of traveling over a path defined on said common substrate;
- a castor element pivotally mounted to said mechanical element for movement about a pivot axis;
- and
- a cutting wheel rotatably mounted to said castor element so as to provide a castoring action for said cutting wheel, said cutting wheel having an asymmetrical cutting edge for selectively engaging said common substrate, wherein said mechanical element which is capable of guiding said cutting wheel over said path so that said cutting edge severs said common substrate to provide one or more of said microelectronic packages separate from one another.
A method for separating microelectronic packages assembled to a common substrate comprising the steps of:
- defining a path on said common substrate;
- providing a cutting apparatus including a cutting wheel having an asymmetrical cutting edge, said cutting wheel being castor mounted to said cutting apparatus;
- guiding said cutting wheel over said path;
- during the guiding step, engaging said common substrate with said cutting edge so as to sever said common substrate to provide one or more of said microelectronic packages separate from one another.
A method for separating microelectronic packages assembled to a common substrate comprising:
- providing a cutting surface;
- providing said common substrate atop said cutting surface;
- defining a path on said common substrate;
- providing a cutting apparatus including a cutting wheel having a cutting edge, said cutting wheel being castor mounted to said cutting apparatus, wherein said cutting edge is asymmetrical so that said cutting wheel may pass closely by said microelectronic packages;
- guiding said cutting wheel over said path;
- during the guiding step, engaging said common substrate and said cutting surface with the cutting edge of said cutting wheel so as to sever said common substrate and separate one or more of said microelectronic packages from one another.
Dependencies are inferred from the claim text.