Method and apparatus for dicing electronic substrate

Abstract

A manufacturing method and apparatus for dicing printed circuit boards is disclosed that permits PCB's to be manufactured with greater component density and cut less expensively. The disclosed method includes forming a raw substrate to include conductive traces, mounting components on the substrate, testing the PCB and then cutting off the waste edges. The PCB can be formed and tested with components mounted on one or both sides of the PCB, and the waste edges can be cut off even with components mounted on both sides of the board. A workpiece fixture is provided that includes a recessed cavity into which PCB components extend. Double-sided boards can be cut using the disclosed workpiece fixture. The cavity includes a vacuum hole through which suction is provided to hold the PCB in place during cutting. Additional vacuum holes preferably are provided to hold the wings in place after they are removed. If desired, one or more saw blade guides can be formed in the workpiece fixture to accommodate a saw blade to avoid damaging the top surface of the fixture. The guides also permit PCB's to be cut without the need for space tape and the cost and imprecision associated with such tape. If desired, the substrate can be formed to include test pads in the wings which are subsequently cut off during manufacturing, thereby providing more room for components in the central area. As a result, the manufacturing process is simplified, manufacturing cost is reduced, and component density is increased.

Dependencies are inferred from the claim text.