Mechanical assembly for regulating the temperature of an electronic device which incorporates at least two leaf springs for self-alignment plus a low initial contact force and a low profile

Abstract

A mechanical assembly for regulating the temperature of an integrated circuit chip is comprised of a frame which has at least two spaced-apart spring supports. Respective leaf springs extend from each of the spring supports towards each other. And, a heat exchanger lies in the space between the spring supports, attaches to all of the leaf springs, and has a face for mating with the chip. With this assembly, the heat exchanger exerts a very small force at its initial point of contact on the chip; the length of the leaf springs do not add to the profile of the assembly; no slippage occurs between the heat exchanger and the chip; and, the leaf springs prevent the heat exchanger from twisting and becoming offset relative to the chip.

Dependencies are inferred from the claim text.