Method and apparatus for manufacturing a semiconductor integrated circuit
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsShigeru Harada, Takashi Yamashita, Noriaki Fujiki, Tsutomu Tanaka
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Abstract
A method and an apparatus for manufacturing a semiconductor integrated circuit in which semiconductor elements (2) and a wiring structure connecting the semiconductor elements (2) one another are located on a semiconductor substrate (1). In the method or apparatus, a series of wiring elements (4,6,7,9,10), each of which constructs the wiring structure is formed sequentially, then the semiconductor integrated circuit under manufacturing process is washed by neutral solution containing oxidant during the process of forming of the wiring elements (4,6,7,9,10).
Claims14
A method of manufacturing a semiconductor integrated circuit in which semiconductor elements and a wiring structure connecting said semiconductor elements to one another are located on a semiconductor substrate, said method comprising the steps of:
- forming sequentially a series of wiring elements, each of which constructs said wiring structure;
- and washing said semiconductor integrated circuit under a manufacturing process by means of a neutral solution containing oxidant so as to selectively remove debris or residue with respect to the wiring elements during the step of forming said wiring elements.
Dependencies are inferred from the claim text.