Single station cutting apparatus for separating semiconductor packages

Apparatus for separating a semiconductor package from a substrate by cutting an outline on said substrate defining the periphery of said semiconductor package, said apparatus comprising:

• a surface for supporting said substrate;
• a cutting device moveable toward said surface in a first direction to a predetermined maximum position for cutting said outline of said semiconductor package partially through said substrate;
• and
• a member moveable in a second direction opposite said first direction and engageable with said substrate within said outline such that said semiconductor package is moved in said second direction with said member relative to a remainder of said substrate outside of said periphery for completing the separation of said semiconductor package from said substrate without moving said remainder of said substrate relative to said surface.

A semiconductor package singulation apparatus for separating a semiconductor package from a substrate, said substrate being characterized by a generally planar film layer and a sealant layer, said semiconductor package being at least partially encapsulated by said sealant layer, said apparatus including:

• a first die assembly including a cutter blade for cutting said substrate;
• a second die assembly for at least partially supporting said substrate during cutting of said substrate by said cutter blade, said second die assembly including a moveable punch member engageable with said substrate;
• an actuator for moving said first die assembly relative to said second die assembly in a first direction to a predetermined maximum position to cause said cutter blade to cut through said sealant layer and at least partially through said film layer about a periphery of said semiconductor package;
• and
• an actuator for moving said punch member relative to said substrate in a second direction opposite said first direction for causing said punch member to engage said substrate to effect final cutting of said film layer for separating said semiconductor package from a remainder of said substrate outside of said periphery.