Conductive bonding design and method for aluminum backed circuits
AssigneeInternational Business Machines Corporation
InventorsLisa Jeanine Jimarez, David Noel Light, Andrew Michael Seman, David Brian Stone
Life of this patent
Estimating the term…
Abstract
The present invention provides a new device and technique for enhancing the electrical properties of the thick metal backer/adhesive bond/ground plane interface. The enhanced electrical properties are obtained by micro-roughening a connection surface of the thick metal backer prior to forming the thick metal backer/adhesive bond/ground plane interface.
Claims30
A method for improving the electrical properties of circuit board assemblies comprising the steps of:
- a) vapor-grit blasting with a spray pressure of at least 65 psi and no more than 150 psi said connection surface to micro-roughen said connection surface;
- b) protecting a ground plane of a circuit board from oxidation;
- c) dispensing an electrically conductive adhesive on one or both of said connection surface and said ground plane;
- d) joining under pressure said ground plane and said connection surface in a clamping fixture to form a circuit board assembly;
- and
- e) curing said circuit board assembly to form a stable bond between said connection surface, said adhesive and said ground plane.
A method for improving the electrical properties of circuit board assemblies comprising the steps of:
- a) vapor grit blasting said connection surface to micro-roughen said connection surface;
- b) protecting a ground plane of a circuit board from oxidation;
- c) dispensing an electrically conductive adhesive on one or both of said connection surface and said ground plan;
- d) joining under pressure said ground plane and said connection surface in a clamping fixture to form a circuit board assembly;
- and
- e) curing said circuit board assembly at a temperature of at least 130° C. and no more than 165° C. for at least 25 minutes and no more than 55 minutes at a temperature ramp rate of at least 10° C. per minute and no more than 12° C. per minute to form a stable bond between said connection surface, said adhesive and said ground plane.
Dependencies are inferred from the claim text.