Electronic component installation method
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsJunichi Hada, Kimiaki Sano, Atsushi Tanabe
Life of this patent
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Abstract
In an electronic component installation device for manufacturing an electronic circuit substrate, wherein components are picked up from a parts supply device and placed on a circuit substrate, the height of the installing surface s of an electronic component 10 from a reference surface is detected with the use of a three-dimensional imaging device 2, and the distance the suction nozzle 9 of the mounting head 1 is lowered is accurately determined with respect to each of electronic components that vary in thickness.
Claims19
A method of installing an electronic component on a circuit substrate with a mounting head equipped with a parts holding means with which the electronic component is held comprising the steps of:
- a first step of picking up a prescribed electronic component with the parts holding means from a parts supply section;
- a second step of moving the mounting head which has picked up the electronic component from the parts supply section to a point above a three-dimensional imaging device;
- a third step of detecting a distance from a surface of the circuit substrate on which said electronic component is to be mounted to an installing surface of the electronic component that is held on the parts holding means;
- a fourth step of determining an amount of lowering the parts holding means for placing the electronic component on the circuit substrate based on a detected distance;
- and
- a fifth step of lowering the parts holding means by the determined descending amount to a height where the installing surface of the electronic component makes contact with the circuit substrate.
A method of installing an electronic component on a circuit substrate comprising the steps of:
- preparing component data by measuring dimensions of electronic components and preliminarily storing the component data with respect to every type of electronic components to be installed;
- moving on a horizontal plane a mounting head equipped with a parts holding means with which the electronic component is held;
- picking up a prescribed electronic component with the parts holding means from a parts supply section;
- moving the mounting head which has picked up the electronic component from the parts supply section to a point above a three-dimensional imaging device;
- detecting a height of an installing surface of the electronic component from a surface of the circuit substrate on which said electronic component is to be mounted;
- obtaining a thickness of the electronic component from a detected result;
- correcting the component data of the electronic component in accordance with the obtained thickness of the electronic component;
- determining a lowering amount of the parts holding means in accordance with the corrected information;
- and
- placing the electronic component on the circuit substrate in a predetermined installing location by lowering the parts holding means by the determined lowering amount.
A system of installing electronic components on a substrate comprising:
- a source of electronic components;
- a component holding unit that can removably secure an electronic component from the source and translate it to the substrate;
- a detector for imaging the electronic component held by the component holding unit, to provide imaging data;
- means for determining a height of the electronic component from the image data and a relative distance to move the component holding unit to a proper position relative to the substrate;
- and
- means for moving the component holding unit to the proper position based on a predetermined incremental movement amount added to an output from the means for determining to insure a predetermined pressing force is applied to the substrate by the electronic component.
A system of installing electronic components on a substrate comprising:
- a source of electronic components;
- a component holding unit that can removably secure an electronic component from the source and translate it to the substrate;
- a detector for imaging the electronic component held by the component holding unit to provide image data;
- means for determining a cross-sectional area of the electronic component from the image data;
- means for storing a reference area value of the electronic component which represents a value smaller than a length and a width of the electronic component multiplied;
- means for determining the installing surface of the electronic component by comparing the cross-sectional area with the stored reference area value;
- means for determining a height of the electronic component from the image data and a relative distance to move the component holding unit and the electronic installing surface to a proper position relative to the substrate;
- and
- means for moving the component holding unit to the proper position based on an output from the means for determining.
Dependencies are inferred from the claim text.