Resist material and fabrication method thereof
AssigneeNippon Telegraph and Telephone Corporation
InventorsTetsuyoshi Ishii, Toshiaki Tamamura, Hiroshi Nozawa, Kenji Kurihara
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AssigneeNippon Telegraph and Telephone Corporation
InventorsTetsuyoshi Ishii, Toshiaki Tamamura, Hiroshi Nozawa, Kenji Kurihara
Estimating the term…
A resist material having a resist and particles mixed into the resist, a major component of the particles being a cluster of carbon atoms, is provided. A method for fabricating a resist material is also provided, the method repeatedly performing: a first step of coating a substrate with a resist film; and a second step of depositing particles whose major component is a cluster of carbon atoms on the resist film. Accordingly, a resist film with high etching resistance can be obtained, and it is possible to realize a reduction in the thickness of the resist film, improvements of contrast of resist patterns; resist sensitivity; heat resistance of resist films; mechanical strength of resist patterns; and further, stabilization of resist sensitivity. Therefore, highly precise fine pattern fabrication can be realized.
A method for fabricating a resist material, by repeatedly performing:
A resist material having a resist and particles whose major component is a cluster of carbon atoms, wherein a resist film and the particles are alternatively deposited on a substrate.
Dependencies are inferred from the claim text.