Composite laminate circuit structure and method of forming the same

A composite laminate structure comprising,

• first and second circuit board elements each having circuitry on at least one face thereof and plated through holes,
• a voltage plane element laminated between said first and second circuit board elements, each having at least one voltage plane having opposite faces with a layer of fully cured photopatterned dielectric material on each face thereof with the at least one face of each circuit board element oriented away from said voltage plane element,
• at least one hole etched through said voltage plane element without contacting said voltage plane, and at least one opening etched through each layer of photopatterned dielectric material of said voltage plane element terminating at said voltage plane to explore a portion thereof,
• each through hole and each opening in said voltage plane element being aligned with a plated through hole in at least one of said circuit board elements to provide surface on said voltage plane element communicating with said plated through holes;
• a unitary layer of electrically conducting material extending through each hole etched through the voltage plane and each plated through hole aligned therewith, and a unitary layer of conducting material in each of said holes etched in the voltage plane and its associated aligned platted through holes in a circuit board element and the exposed portion of the voltage plane.