Process for depositing a layer of material over a substrate

A process for depositing a layer of material over a substrate comprising:

• placing the substrate into a plating system including:
• a cup;
• a first electrode within the cup;
• a second electrode electrically connected to the substrate;
• a conductor that is spaced apart from each of the substrate, the first electrode, and the second electrode;
• and
• an ionic liquid, wherein the ionic liquid contacts the first electrode, the second electrode, the substrate, and the conductor;
• biasing the first electrode to a first potential and the second electrode to a second potential, wherein:
• the layer of material is deposited on the substrate and second electrode;
• and
• the first potential is different from the second potential;
• removing the substrate from the plating system;
• and
• biasing the conductor to a third potential and the second electrode to a fourth potential after removing the substrate from the plating system, wherein the third potential is lower than the fourth potential, and wherein at least a portion of the layer of material on the second electrode is transferred to the conductor.

A process for depositing a layer of material over a substrate comprising:

• placing the substrate into a plating system including:
• a cup;
• a first electrode within the cup;
• a second electrode electrically connected to the substrate;
• a conductor that is spaced apart from each of the substrate, the first electrode, and the second electrode;
• and
• an ionic liquid, wherein the ionic liquid contacts the first electrode, the second electrode, the substrate, and the conductor;
• biasing the first electrode to a first potential and the second electrode to a second potential, wherein:
• the layer of material is deposited on the substrate and second electrode;
• and
• the first potential is different from the second potential;
• removing the substrate from the plating system;
• and
• transferring at least a portion of the layer of material from the second electrode to the conductor.

A process for depositing a layer of material over a substrate comprising:

• placing the substrate into a plating system including:
• a first electrode;
• a second electrode electrically connected to the substrate;
• a conductor that is spaced apart from each of the substrate, the first electrode, and the second electrode;
• and
• an ionic liquid, wherein the ionic liquid contacts the first electrode, the second electrode, the substrate, and the conductor;
• biasing the first electrode to a first potential and the second electrode to a second potential, wherein:
• the layer of material is deposited on the substrate and second electrode;
• and
• the first potential is different from the second potential;
• removing the substrate from the plating system;
• and
• transferring at least a portion of the layer of material from the second electrode to the conductor.