Chamber liner for semiconductor process chambers
AssigneeLam Research Corporation
InventorsAlan M. Schoepp, William M. Denty, Jr., Michael Barnes
Life of this patent
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AssigneeLam Research Corporation
InventorsAlan M. Schoepp, William M. Denty, Jr., Michael Barnes
Estimating the term…
A chamber liner for use in a semiconductor process chamber and a semiconductor process chamber containing the chamber liner are disclosed. The process chamber includes a housing having an inner surface defining a chamber in which a vacuum is drawn during processing of a semiconductor wafer. The chamber liner has a plasma confinement shield with a plurality of apertures. An outer sidewall extends upwardly from the plasma confinement shield. An outer flange extends outwardly from the outer sidewall such that the outer flange extends beyond the chamber and into a space at atmospheric pressure. The chamber liner preferably further includes an inner sidewall that extends upwardly from the plasma confinement shield. The plasma confinement shield, the inner and outer sidewalls, and the outer flange are preferably integral with one another.
A chamber liner for use in a process chamber used in semiconductor fabrication, comprising:
A chamber liner for use in a process chamber used in semiconductor fabrication, comprising:
A chamber liner, comprising:
Dependencies are inferred from the claim text.