Silicone gel composition and silicone gel produced therefrom

A multi-part silicone composition, comprising:

• (A) 100 parts by weight of a first polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule and having a viscosity of from 0.2 to 10 Pa·s at 25° C.;
• (B) at least about 0.5 part by weight to about 10 parts by weight of a second polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, wherein the second polydiorganosiloxane has a viscosity at 25° C. of at least four times the viscosity of the first polydiorganosiloxane at 25° C.;
• (C) an organohydrogensiloxane having the average formula R7Si(SiOR82H)3 wherein R7 is an alkyl group having 1 to 18 carbon atoms or aryl, R8 is an alkyl group having 1 to 4 carbon atoms, in an amount sufficient to provide from 0.1 to 1.5 silicon-bonded hydrogen atoms per alkenyl group in components (A) and (B) combined;
• and
• (D) a hydrosilylation catalyst in an amount sufficient to cure the composition, provided neither component (A) nor component (B) are present with components (C) and (D) in the same part.

A kit for preparing a silicone gel composition, comprising:

• a first package containing a homogeneous mixture of
• (A) 5 to 95 parts by weight of a first polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule and having a viscosity of from 0.2 to 10 Pa·s at 25° C.;
• (B) 0 to 10 parts by weight of a second polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, wherein the second polydiorganosiloxane has a viscosity at 25° C. of at least four times the viscosity of the first polydiorganosiloxane at 25° C.;
• and
• (D) a hydrosilylation catalyst;
• and
• a second package containing
• (A) 95 to 5 parts by weight of a first polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule and having a viscosity of from 0.2 to 10 Pa·s at 25° C.;
• (B) 0 to 10 parts by weight of a second polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, wherein the second polydiorganosiloxane has a viscosity at 25° C. of at least four times the viscosity of the first polydiorganosiloxane at 25° C.;
• and
• (C) an organohydrogensiloxane having the average formula R7Si(OSiR82H)3 wherein R7 is an alkyl group having 1 to 18 carbon atoms or aryl, R8 is an alkyl group having 1 to 4 carbon atoms, and wherein the amount of component (A) in the first package and the second package combined is 100 parts by weight, the amount of component (B) in the first package and the second package combined is at least about 0.5 part by weight to about 10 parts by weight, component (C) is present in an amount sufficient to provide from 0.1 to 1.5 silicon-bonded hydrogen atoms per alkenyl group in components (A) and (B) in the first package and the second package combined;
• and component (D) is present in an amount sufficient to cure the composition formed by combining the first package and the second package.