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US 6,160,526 AGranted
IC module and IC card
AssigneeRohm Co., Ltd.
InventorsMinoru Hirai, Shigeyuki Ueda, Osamu Miyata, Tomoharu Horio
Life of this patent
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Abstract
An IC module incorporated in an IC-card includes a substrate, an IC chip mounted on the substrate, and an antenna coil electrically connected to the IC chip. The antenna coil includes a conductive film which is patterned on a surface of the substrate, thereby facilitating fabrication of the IC module while realizing a thickness reduction of the IC module.
Claims34
An IC module comprising:
- a substrate,
- an IC chip mounted on the substrate, and
- an antenna coil electrically connected to the IC chip,
- wherein the antenna coil includes a conductive film which is patterned on a surface of the substrate,
- wherein the antenna coil includes a spiral portion having a plurality of spiral turns,
- wherein the substrate is provided with a pair of terminals disposed inwardly of the spiral portion in connection to starting and terminating ends, respectively, of the antenna coil,
- wherein the IC chip has a main surface formed with a pair of electrodes for connection to the pair of terminals,
- wherein the antenna coil further includes a bent extension extending from the respective spiral turns, and
- wherein the bent extension includes a first portion inwardly from each spiral turn toward the IC chip, a second portion extending from the first portion to pass between the pair of terminals, and a third portion extending outwardly from the second portion to a next spiral turn.
6 more elements
An IC module comprising:
- a substrate,
- an IC chip mounted on the substrate,
- an antenna coil electrically connected to the IC chip, including a conductive film which is patterned on a surface of the substrate, and
- an auxiliary film having a surface formed with a conductor pattern which is symmetrical or substantially symmetrical to the pattern of the antenna coil,
- wherein the substrate and the auxiliary film are bonded to each other to bring the conductive film pattern of the antenna coil into connection to the conductor pattern of the auxiliary film.
2 more elements
An IC module comprising:
- a substrate,
- an IC chip mounted on the substrate,
- an antenna coil electrically connected to the IC chip, including a conductive film which is patterned on a surface of the substrate,
- an adhesive layer for bonding the substrate and the IC chip to each other, and
- a bond assisting layer disposed at a portion of the substrate for adhesion to the adhesive layer, the bond assisting layer being made of a material having a higher adhesion to the adhesive layer than the substrate.
2 more elements
An IC module comprising:
- a substrate,
- an IC chip mounted on the substrate, and
- an antenna coil electrically connected to the IC chip, including a conductive film which is patterned on a surface of the substrate,
- wherein the substrate has weakening means adjacent the IC chip.
1 more element
An IC module comprising:
- a substrate,
- an IC chip mounted on the substrate,
- an antenna coil electrically connected to the IC chip, including a conductive film which is patterned on a surface of the substrate, and
- a sealing member for enclosing the IC chip,
- wherein the sealing member has weakening means.
2 more elements
An IC module comprising:
- a substrate,
- an IC chip mounted on the substrate,
- an antenna coil electrically connected to the IC chip, including a conductive film which is patterned on a surface of the substrate, and
- a sealing member for enclosing the IC chip,
- wherein the IC chip is mounted at a central portion of the substrate, the substrate being formed with a plurality of slits extending from a peripheral edge of the substrate toward the central portion.
2 more elements
An IC module comprising:
- a substrate,
- an IC chip mounted on the substrate,
- an antenna coil electrically connected to the IC chip, including a conductive film which is patterned on a surface of the substrate,
- a covering member which is bonded to the substrate for covering the IC chip, and
- an elastic member interposed between the covering member and the IC chip,
- wherein the IC chip is pressed against the substrate by the elastic member.
3 more elements
An IC-card comprising an IC module which includes a substrate, an IC chip mounted on the substrate, and an antenna coil electrically connected to the IC chip, the antenna coil comprising a conductive film which is patterned on a surface of the substrate,
- wherein the antenna coil includes a spiral portion having a plurality of spiral turns,
- wherein the substrate is provided with a pair of terminals disposed outwardly of the spiral portion in connection to starting and terminating ends, respectively, of the antenna coil,
- wherein the IC chip has a main surface formed with a pair of electrodes for connection to the pair of terminals,
- wherein the antenna coil further includes a bent extension extending from the respective spiral turns,
- wherein the bent extension includes a first portion outwardly from each spiral turn toward the IC chip, a second portion extending from the first portion to pass between the pair of terminals, and a third portion extending inwardly from the second portion to a next spiral turn, and
- wherein the IC module is incorporated in a card member.
3 more elements
An IC-card comprising an IC module which includes a substrate, an IC chip mounted on the substrate, and an antenna coil electrically connected to the IC chip,
- wherein the antenna coil includes a conductive film which is patterned on a surface of the substrate,
- wherein the antenna coil includes a spiral portion having a plurality of spiral turns,
- wherein the substrate is provided with a pair of terminals disposed inwardly of the spiral portion in connection to starting and terminating ends, respectively, of the antenna coil,
- wherein the IC chip has a main surface formed with a pair of electrodes for connection to the pair of terminals,
- wherein the antenna coil further includes a bent extension extending from the respective spiral turns,
- wherein the bent extension includes a first portion inwardly from each spiral turn toward the IC chip, a second portion extending from the first portion to pass between the pair of terminals, and a third portion extending outwardly from the second portion to a next spiral turn, and
- wherein the IC module is incorporated in a card member.
4 more elements
Dependencies are inferred from the claim text.