High dielectric constant flexible polyimide film and process of preparation
AssigneeE. I. Du Pont de Nemours and Company
InventorsYueh-Ling Lee, Gary Min
Life of this patent
Estimating the term…
Abstract
A flexible, high dielectric constant polyimide film composed of either a single layer of an adhesive thermoplastic polyimide film or a multilayer polyimide film having adhesive thermoplastic polyimide film layers bonded to one or both sides of the film and having dispersed in at least one of the polyimide layers from 4 to 85 weight % of a ferroelectric ceramic filler, such as barium titanate or polyimide coated barium titanate, and having a dielectric constant of from 4 to 60. The high dielectric constant polyimide film can be used in electronic circuitry and electronic components such as multilayer printed circuits, flexible circuits, semiconductor packaging and buried film capacitors.
Claims10
A high dielectric constant, flexible multilayer polyimide film comprising a center thermoplastic or thermoset polyimide film layer having layers of an adhesive thermoplastic polyimide film on one or both sides and having dispersed in at least one of the polyimide layers from 4 to 85 weight %, based on the weight of the film layer, of a ferroelectric ceramic filler, wherein the ferroelectric ceramic filler is surface coated with a thermoplastic or thermoset polyimide and wherein the multilayer polyimide film has a dielectric constant of from 4 to 60.
A high dielectric constant, flexible multilayer polyimide film comprising a center thermoplastic or thermoset polyimide film layer having layers of an adhesive thermoplastic polyimide film on one or both sides and having dispersed in at least one of the polyimide layers from 4 to 85 weight %, based on the weight of the film layer, of a ferroelectric ceramic filler, wherein the adhesive thermoplastic polyimide comprises a copolyimide containing from 60 to 98 mol % of repeating imide units derived from 4,4'-oxydiphthalic dianhydride and an aromatic ether diamine of the formula ##STR3## and from 2 to 40 mol % of additional repeating imide units of the formula ##STR4## wherein R is an aromatic tetravalent radical and R' is a divalent radical of an aromatic or an aliphatic diamine containing at least two carbon atoms and the two amino groups of the diamine are each attached to separate carbon atoms of the divalent radical and wherein the multilayer polyimide film has a dielectric constant of from 4 to 60.
A high dielectric constant, flexible multilayer polyimide film comprising a center thermoplastic or thermoset polyimide film layer having layers of an adhesive thermoplastic polyimide film on one or both sides and having dispersed in at least one of the polyimide layers from 4 to 85 weight %, based on the weight of the film layer, of a ferroelectric ceramic filler, wherein the ceramic filler comprises a mixture of a polyimide surface coated ceramic filler and uncoated ceramic filler and wherein the multilayer polyimide film has a dielectric constant of from 4 to 60.
A high dielectric constant, flexible multilayer polyimide film comprising a center thermoplastic or thermoset polyimide film layer having layers of an adhesive thermoplastic polyimide film on one or both sides and having dispersed in at least one of the polyimide layers from 4 to 85 weight %, based on the weight of the film layer, of a ferroelectric ceramic filler, wherein the ferroelectric ceramic filler additionally includes a conductive core/shell particulate filler and wherein the multilayer polyimide film has a dielectric constant of from 4 to 60.
A high dielectric constant, flexible multilayer polyimide film comprising a center thermoplastic or thermoset polyimide film layer having layers of an adhesive thermoplastic polyimide film on one or both sides and having dispersed in at least one of the polyimide layers from 4 to 85 weight %, based on the weight of the film layer, of a ferroelectric ceramic filler, wherein the center polyimide film layer contains from 40 to 75 weight % of the ceramic filler, the adhesive thermoplastic polyimide film layers contain from 20 to 50 weight % of the ceramic filler and wherein the multilayer polyimide film has a dielectric constant of from 4 to 60.
A high dielectric constant, flexible multilayer polyimide film comprising a center or thermoset polyimide film layer having layers of an adhesive thermoplastic polyimide film on one or both sides and having dispersed in at least one of the polyimide layers from 4 to 85 weight %, based on the weight of the film layer, of a ferroelectric ceramic filler, wherein the center theromset polyimide film layer is derived from pyromellitic dianhydride and 4,4'-diaminodiphenyl ether, the outer thermoplastic adhesive polyimide film layers are derived from 4,4'-oxydiphthalic dianhydride, pyromellitic dianhydride and 1,3-bis(4-aminophenoxy) benzene and wherein the multilayer polyimide film has a dielectric constant of from 4 to 60.
Dependencies are inferred from the claim text.