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US 6,153,361 AGranted
Method of removing photoresist at the edge of wafers
AssigneeUnited Microelectronics Corp.
InventorsMing-Hua Liu, Chuck Chen, Shu-Ping Lin, Eddie Chen, Ming-Tzong Yung
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Abstract
A method of removing photoresist at the edge of waters in an integrated circuit the method comprising the following steps. A substrate having at least a MOS component region thereabove is provided. A photoresist layer is formed over the substrate. A pattern is defined on the photoresist layer by exposure and development. The photoresist layer at the edge of the substrate is removed by a chemical reagent and centrifugal effect.
Claims6
A method of removing photoresist at the edge of wafers in an integrated circuit comprising the steps of:
- providing a substrate having at least a MOS component region thereabove;
- forming a photoresist layer over said substrate;
- defining a pattern on said photoresist layer by exposure and development;
- and
- removing said photoresist layer at the edge of said substrate by a chemical reagent and centrifugal effect.
2 more elements
Dependencies are inferred from the claim text.