Stackable integrated diode packaging

A laser array comprising:

• a plurality of cells positioned substantially adjacent to each other in an array configuration, each of the plurality of cells including:
• a base unit having a laser element;
• an isolator unit positioned adjacent to the base unit;
• and
• a flow route unit positioned adjacent to the base unit;
• wherein each of the base unit, the isolator unit, and the flow route unit includes a unit cavity for passing coolant therethrough, the unit cavity of the base unit being substantially adjacent to the respective laser element for passing coolant adjacent to the laser element to substantially uniformly cool the laser element, and each of the unit cavities of the respective units of a respective cell forms a substantially contiguous cell cavity through the respective cell for passing coolant through the cavity;
• and
• wherein, for each of the plurality of cells, the respective cell cavity thereof is positioned substantially adjacent to another cell cavity of another cell of the plurality of cells, thereby forming a substantially contiguous array cavity extending through the plurality of cells for passing coolant therethrough.

A method for cooling a plurality of laser elements in a laser array, the method comprising the steps of:

• positioning a plurality of cells substantially adjacent to each other in an array configuration, wherein each of the plurality of cells includes:
• a respective laser element;
• and
• a cell cavity;
• positioning each cell cavity substantially adjacent to another cell cavity of another cell of the plurality of cells, thereby forming a substantially contiguous array cavity extending through the plurality of cells;
• and
• passing coolant through the substantially contiguous array cavity to substantially uniformly cool each laser element of each cell.