US 6,151,214 AGranted

Bearing structure of a central processing unit

AssigneeFirst International Computer, Inc.

InventorChih-Chiang Yeh

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Abstract

Disclosed is a bearing structure of a central processing unit comprises a radiating plate, a back plate, a plurality of screws and elastic elements. The radiating plate has a heat conductive portion and a plurality of sleeves. The back plate is installed below the radiating plate and has a plurality of studs. The plurality of screws are placed within the sleeves of the radiating plate, and protrudes from the bottom of the radiating plate. The plurality of elastic elements being installed between the screws and the sleeve. The radiating plate is moved by the elastic elements so that the heat conductive portion of the radiating plate presses elastically the central processing unit. Therefore, the pressure will not be too large so as to harm the central processing unit, or too small so as to cause the unfastening therebetween. As a result, during assembly, the fastening force of the screws would not be adjusted. Thus, the assembly work becomes easily and the cost is reduced.

Claims7

Dependent claims

A bearing structure of a central processing unit, comprising:

a radiating plate, a heat conductive portion being installed thereon, a plurality of sleeves being installed on the radiating plate, a lower portion of each sleeve being formed with a through hole, and a bottom of the sleeve protruding from a bottom of the radiating plate;
a back plate arranged below the radiating plate, a plurality of studs being arranged on the back plate;
a plurality of screws arranged within the sleeves of the radiating plate, each screw protruding from the bottom of a respective sleeve from the through hole and then screwedly connected to a corresponding stud of the back plate, the bottom of each sleeve being in contact with a top portion of a respective stud;
a plurality of elastic elements each being installed between a head portion of a respective screw and the bottom of the sleeve;
and
a mother board arranged between the radiating plate and the back plate, a central processing unit being installed on the mother board, the central processing unit being connected to the heat conductive portion of the radiating plate through a heat conductive glue.

3 more elements

Dependencies are inferred from the claim text.