Modulator transfer process and assembly

A method of repairing an electro-optic element, said method comprising:

• providing an electro-optic assembly comprising a substrate, a first electro-optic modulator material defined on said substrate, and a first electrode overlying said modulator material, said electro-optic assembly having a defect thereon;
• removing said first electrode and said first modulator material from said substrate of said electro-optic assembly;
• and
• affixing a second electro-optic modulator material having an overlying transfer substrate.

A method for fabricating an electro-optic modulator material, said method comprising:

• providing a first transfer substrate comprising a top surface;
• forming an electro-optic material onto said top surface of said first transfer substrate to attach said electro-optic material to said first transfer material, said electro-optic material having an exposed surface;
• forming a second transfer substrate overlying said exposed electro-optic material surface, said second transfer substrate being attached to said electro-optic material at lower strength than said attachment of said first transfer substrate to said electro-optic material;
• wherein said second transfer substrate has a larger surface area than said exposed electro-optic material surface to define a protruding region of said second transfer substrate that protrudes outside an edge of said electro-optic material;
• applying a force to said protruding region to remove said second transfer substrate from said electro-optic material and leaving said electro-optic material substantially affixed to said first transfer material;
• and
• applying said electro-optic material using said first transfer substrate onto a substrate.