US 6,150,730 AGranted

Chip-scale semiconductor package

AssigneeAdvanced Semiconductor Engineering, Inc.

InventorsChih-Ming Chung, Kuo-Pin Yang, Jen-Kuang Fang, Su Tao

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Abstract

A chip-scale semiconductor package mainly includes a semiconductor chip, a substrate and a package body. Said chip is attached onto said substrate by an adhesive layer. Said chip has a plurality of bonding pads formed thereon. Said adhesive layer has an aperture corresponding to the bonding pads of said chip such that the bonding pads can be exposed within an aperture. Said substrate has several through-holes respectively corresponding to the bonding pads of said chip and parts of the area around the edge of said chip for dispensing of encapsulant after the soldering of leads of said substrate to the bonding pads of said chip. The encapsulant dispensed into the through-holes can flow from the surface of said chip to the edge thereof. Said package body has one portion provided within the through-hole of said substrate and another portion provided around the edge of said chip whereby encapsulation process is accomplished without having to turn the whole semiconductor package device.

Claims6

Dependent claims

A chip scale semiconductor package comprising:

a semiconductor chip having a plurality of bonding pads formed thereon;
an adhesive layer having an aperture defined therein, said adhesive layer attached to the surface of said semiconductor chip in such a manner that the aperture corresponds to the bonding pads of said semiconductor chip;
a substrate having a through-hole defined therein, said substrate attached to said adhesive layer in such a manner that the through-hole traverses from one side of said chip to the other and corresponds to the aperture of said adhesive layer, the through-hole of said substrate is provided with a plurality of leads connected to the bonding pads of said semiconductor chip;
and
a package body having one portion within the through-hole of said substrate and another portions around the edge of said chip,
wherein said package bodies are formed within the through-hole of said substrate and around the edge of said chip at the same time, and the encapsulation process is accomplished by dispensing encapsulant through the through-hole and without having to turn the whole semiconductor package device.

3 more elements

Dependencies are inferred from the claim text.