Routing density enhancement for semiconductor BGA packages and printed wiring boards

A device for routing a plurality of external electrical contacts, comprising:

• a plurality of electrical contacts for coupling with the external electrical contacts, the plurality of electrical contacts disposed on a first surface lying on a first plane;
• a first plurality of traces disposed on a second surface, the first surface lying on a second plane that is different from the first plane;
• a plurality of surface connectors, each of the plurality of surface connectors connecting a corresponding one of a first group of the plurality of electrical contacts to a corresponding one of the first plurality of traces such that the first group of the plurality of electrical contacts is at least partially routed along the second surface;
• a second plurality of traces disposed on the first surface, each of the second plurality of traces connected to a corresponding one of a second group of the plurality of electrical contracts, such that the second group of the plurality of electrical contacts is at least partially routed on the first surface;
• a plurality of short traces disposed on the first surface, each of the plurality of short traces electrically coupling a corresponding one of the first group of the plurality of electrical contacts with a corresponding one of the plurality of surface connectors;
• wherein
• each of a plurality of lines is defined by the geometric center of a corresponding one of the first group of electrical contacts and a corresponding one of the plurality of surface connectors;
• and
• a first one of the plurality of lines intersects a second one of the plurality of lines at a first angle.