Component carrier with raised bonding sites
AssigneeInternational Business Machines Corporation
InventorsNatalie Barbara Feilchenfeld, Stephen Joseph Fuerniss, Michael Anthony Gaynes, Mark Vincent Pierson, Pat Hoontrakul
Life of this patent
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Abstract
Chip carrier packages, integrated circuits, wiring boards, and assemblies in computer systems are made having conductive adhesive interconnections. Electrically conductive polymer paste with metal particles and powders are used with photoimagable polymer films to form the interconnection structure. These articles are produced with screening and printing processes using a screening head and printing machine.
Claims6
A component carrier having raised bonding sites of connected joining material, comprising:
- a substrate having one or more electrically conductive wiring layers, said layers having conductive lines terminating in connecting pad areas;
- a first layer of cured electrically conductive adhesive material positioned over at least part of at least one of said connecting pad areas, providing electrical connection to said connecting pad areas;
- and
- a second layer of uncured electrically conductive adhesive material positioned over at least parts of said first layer of cured electrically conductive adhesive material, forming a connected joining material structure, thereby providing raised bonding sites on said component carrier.
An integrated circuit, comprising:
- a semiconductor chip having a plurality of electrically conductive terminals on a first surface thereof:
- a first layer of cured electrically conductive adhesive material positioned over at least part of at least one of said electrically conductive terminals, providing electrical connection to said electrically conductive terminals;
- and
- a second layer of uncured electrically conductive adhesive material positioned over at least parts of said first layer of cured electrically conductive adhesive material, forming a connected joining material structure, thereby providing raised bonding sites on said integrated circuit.
Dependencies are inferred from the claim text.