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US 6,150,725 AGranted
Semiconductor devices with means to reduce contamination
AssigneeSanyo Electric Co., Ltd.
InventorsKaori Misawa, Hiroyasu Ishihara, Hideki Mizuhara
Life of this patent
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Abstract
An enclosure is formed on a substrate of a semiconductor device surrounding a bonding pad, such that a groove is formed between the enclosure and the bonding pad. An insulating film is formed over the substrate, including the enclosure and the groove. The groove and the film prevent moisture and contaminants from seeping into the semiconductor device.
Claims5
A semiconductor device, comprising:
- a substrate;
- a bonding pad provided over the substrate;
- an enclosure provided over the substrate and surrounding the bonding pad, wherein a groove is formed between the bonding pad and the enclosure;
- and
- a flattening insulating film formed on a surface of the substrate including the enclosure, the groove, and a peripheral portion of the bonding pad.
2 more elements
A semiconductor device, comprising:
- a substrate;
- a bonding pad provided over the substrate;
- and
- an enclosure provided over the substrate and surrounding the bonding pad, wherein a groove is formed between the bonding pad and the enclosure;
- and wherein, the enclosure and the bonding pad are substantially equivalent in height, the semiconductor device further comprising a flattening insulating film formed over the substrate and within in the groove, the insulating film having a thickness substantially equivalent to the height of the enclosure and the bonding pad.
2 more elements
Dependencies are inferred from the claim text.