Direct die contact (DDC) semiconductor package

A semiconductor package comprising:

• a housing comprising a plurality of separate channels and a plurality of electrical connectors within the channels;
• a plurality of semiconductor dice placed in the channels comprising a plurality of electrodes;
• and
• a plurality of conductive adhesive bumps on the electrodes, the bumps attaching and electrically connecting the electrical connectors to the electrodes, the bumps configured to anchor the die within the housing and prevent movement of the connectors, the bumps and the connectors configured to allow placing of the connectors on the bumps without damage to the die.

A semiconductor package comprising:

• a substrate comprising a plurality of electrodes comprising a plurality of first solder bumps comprising a first solder alloy;
• a plurality of dice mounted to the substrate comprising a plurality of edges and a plurality of second solder bumps comprising a second solder alloy;
• an alignment member on the substrate, the alignment member comprising a plurality of alignment openings configured to contact the edges of the dice to align the first solder bumps to the second solder bumps;
• and
• a plurality of bonded connections between the dice and the substrate comprising the first solder bumps and the second solder bumps.

A semiconductor package comprising:

• a substrate;
• an electrode on the substrate comprising a first solder bump;
• a semiconductor die flip chip mounted to the substrate, the die comprising an edge and a second solder bump bonded to the first solder bump;
• and
• an alignment member on the substrate comprising an alignment opening configured to contact the edge of the die to align the first solder bump to the second solder bump, the alignment member comprising a deposited and patterned layer of resist.

A semiconductor package comprising:

• a substrate;
• an electrode on the substrate comprising a first solder bump comprising a first solder alloy having a first melting temperature;
• a semiconductor die flip chip mounted to the substrate, the die comprising an edge, and a second solder bumps bonded to the first solder bump comprising a second solder alloy having a second melting temperature greater than the first melting temperature;
• and
• an alignment member on the substrate configured to contact the edge of the die to align the die on the substrate, the alignment member comprising a deposited, patterned and cured layer of resist.