Multi-layer plated lead frame
AssigneeSamsung Aerospace Industries, Ltd.
InventorsJoong-do Kom, Young-ho Baek, Kyung-soon Bok
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Abstract
A multi-layer plated lead frame is provided. The lead frame has a structure in which a first precious metal plating layer, an intermediate plating layer, and a second precious metal plating layer are sequentially formed on a substrate made of ferroalloy. The lead frame shows improvement in all properties including wire bonding, anti-corrosion, and solderability.
Claims5
A multi-layer plated lead frame comprising a ferroalloy substrate, and a first precious metal plating layer, an intermediate plating layer and a second precious metal plating layer, each plating layer being sequentially formed on the ferroalloy substrate, wherein the intermediate plating layer comprises a copper (Cu) or Cu alloy plating layer and a nickel (Ni) or Ni alloy plating layer.
Dependencies are inferred from the claim text.