Thermal conditioning apparatus
AssigneeMicron Technology, Inc.
InventorsTimothy A. Strodtbeck, John S. Molebash, Bruce L. Hayes, Rex A. Smith, Shawn D. Davis
Life of this patent
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Abstract
A method of exhausting vapors emanating from a surface. The method includes enclosing the surface and dividing the enclosed area into a stagnant region adjacent the surface and an interior region in communication with the stagnant region. The method also includes applying a suction to the interior region and admitting air into the interior region.
Claims17
A method of exhausting vapors emanating from a surface comprising:
- placing a cover having an intake port and an exhaust port over the surface;
- positioning a perforated plate such that the intake port and the exhaust port are disposed on a first side of the perforated plate and the surface is disposed on a second side of the perforated plate;
- and
- applying a suction to the exhaust port.
A method of exhausting vapors emanating from a wafer supported adjacent a surface comprising:
- placing a cover having an intake port and an exhaust port over the wafer;
- positioning a perforated plate such that the intake port and the exhaust port are disposed on a first side of the perforated plate and the wafer is disposed on a second side of the perforated plate;
- and
- applying a suction to the exhaust port.
A method of exhausting vapors emanating from a wafer supported adjacent a surface comprising:
- enclosing the wafer;
- dividing the enclosed area into a stagnant region adjacent the surface and an interior region in communication with the stagnant region;
- applying a suction to the interior region to exhaust vapor emanating from the wafer from the enclosed area;
- and
- admitting air into the interior region.
Dependencies are inferred from the claim text.