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US 6,150,615 AGranted
Economical package with built-in end resistor used for semiconductor device and process of fabrication
AssigneeNEC Corporation
InventorKatsunobu Suzuki
Life of this patent
Estimating the term…
Abstract
A lead frame used for a semiconductor chip has built-in end resistors accurately patterned through lithographic techniques and an etching from a conductive bonding layer between an insulating film and a conductive metallic foil, the conductive metallic foil is patterned into a conductive island for a semiconductor chip and conductive strips for electric signals, and the built-in end resistors achieve impedance matching for the electric signals.
Claims13
A package used for a semiconductor device, comprising:
- an insulating layer having a first surface and a second surface opposite to said first surface;
- a conductive island formed over said first surface;
- a conductive pattern formed over said first surface, spaced from said conductive island, and having at least one conductive strip assigned to an electric signal;
- a conductive bonding layer provided between said first surface and said conductive pattern for bonding said conductive pattern to said insulating layer, and having a portion connected between said at least one conductive strip and a constant potential source so as to serve as an end resistor;
- a ground plane fixed to said second surface, and applied with a constant potential;
- at least one connector fixed to said second surface, and spaced from said ground plane;
- and
- conductive plugs respectively formed in through-holes, and connected between said conductive island and said ground plane and between said at least one conductive strip and said at least one connector.
5 more elements
A package used for a semiconductor device, comprising:
- an insulating layer having a first surface and a second surface opposite to said first surface;
- a conductive island;
- a conductive pattern formed over said first surface, spaced from said conductive island, and having at least one conductive strip assigned to an electric signal;
- a conductive bonding layer provided between said first surface and said conductive pattern for bonding said conductive pattern to said insulating layer, and having a portion connected between said at least one conductive strip and a constant potential source so as to serve as an end resistor;
- a ground plane applied with a constant potential;
- and
- at least one connector fixed to said second surface, and spaced from said ground plane;
- wherein said insulating layer has an aperture, and said aperture is closed by said conductive island and said ground plane held in contact with each other in said aperture.
5 more elements
Dependencies are inferred from the claim text.