High dielectric constant flexible polyimide film and process of preparation
AssigneeE. I. Du Pont de Nemours and Company
InventorsYueh-Ling Lee, Gary Min
Life of this patent
Estimating the term…
Abstract
A flexible, high dielectric constant polyimide film composed of either a single layer of an adhesive thermoplastic polyimide film or a multilayer polyimide film having adhesive thermoplastic polyimide film layers bonded to one or both sides of the film and having dispersed in at least one of the polyimide layers from 4 to 85 weight % of a ferroelectric ceramic filler, such as barium titante or polyimide coated barium titanate, and having a dielectric constant of from 4 to 60. The high dielectric constant polyimide film can be used in electronic circuitry and electronic components such as multilayer printed circuits, flexible circuits, semiconductor packaging and buried film capacitors.
Claims4
A high dielectric constant, flexible polyimide film comprising a single layer of an adhesive thermoplastic polyimide film having dispersed therein from 4 to about 85 weight percent, based on the weight of the film, of a ferroelectric ceramic filler which additionally includes an electrically conductive core/shell particulate filler and wherein the polyimide film has a dielectric constant of from 4 to 60.
A high dielectric constant, flexible polyimide film comprising a single layer of an adhesive thermoplastic polyimide film having dispersed therein from 4 to about 850 weight percent, based on the weight of the film, of a ferroelectric ceramic filler, said filler being surface coated with a thermoset polyimide derived from pyromellitic dianhydride and 4,4'-diaminodiphenyl ether, and wherein the polyimide film has a dielectric constant of from 4 to 60.
A high dielectric constant, flexible polyimide film comprising a single layer of an adhesive thermoplastic polyimide film having dispersed therein from 4 to about 85 weight percent, based on the weight of the film, of a ferroelectric ceramic filler, said filler being surface coated with a thermoset polyimide derived from 4,4'-oxydiphthalic dianhydride, pyromellitic dianhydride and 1,3-bis(4-aminophenoxy)benzene and wherein the polyimide film has a dielectric constant of from 4 to 60.
A high dielectric constant, flexible polyimide film comprising a single layer of an adhesive thermoplastic polyimide film having dispersed therein from 4 to about 85 weight percent, based on the weight of the film, of a ferroelectric ceramic filler comprising barium titanate, said filler being surface coated with a thermoset polyimide derived from 3,3',4,4'-biphenyltetracarboxylic dianhydride, pyromellitic dianhydride and 4,4'-diaminodiphenylether and wherein the polyimide film has a dielectric constant of from 4 to 60.
Dependencies are inferred from the claim text.